Optoelectronic Integration Using the Magnetically Assisted Statistical Assembly Technique : Initial Magnetic

The commercial integration of optoelectronic devices heavily relies on hybrid techniques such as wire bonding and flip-chip bonding. These methods are limited in the scale and flexibility in integration. Research focused on optoelectronic integration is performed using numerous techniques such as direct epitaxy, full-scale wafer bonding, and selfassembly. Magnetically Assisted Statistical Assembly (MASA) is an example of the latter technique and improves scale and flexibility by enabling the simultaneous integration of large numbers of individual devices. This thesis work is focused on the demonstration of the MASA concept through characterization of the magnetic materials forming the foundation for this technique and development of an adequate process technology. Both, the magnetic characteristics and the process technology required to integrate the technology are presented along with results of the integration. Thesis Supervisor: Clifton G. Fonstad Jr. Title: Professor of Electrical Engineering